DDR3 Memory Roundup Six different modules from six different manufacturers G.SKILL   CSX Crucial   Patriot Corsair   Mushkin

Author: Toni Siik Published: 03.10.2008 Product Group: Memory In English Suomeksi

Corsair TW3X4G1600C9DHXNV

The Corsair memory-kit is packaged in the ordinary clear plastic package. Unlike the other kits that are in the roundup, Corsair has decided to show off the memory kit on the front-side of the package. The backside then again has for example the introduction to the DHX-cooling system the optional AirFlow fan unit. When the package is opened the decal from behind the modules opens up and reveals a manual.

Now that the modules are free from their clear prison, we can admire the large DHX-heatsinks that have been included with the high-end Corsair kits for some time now. Corsair was actually one of the first, if not the first, memory-producers that included a larger heatsink with their kits.

• Each module pair is tested together at 1600MHz
• Packaged together immediately following system test
• Tested together at 1600MHz, Vdimm = 1.8V, at latency settings of 9-9-9-24 on NVIDIA nForce 790i Ultra SLI motherboards
• EPP2.0 9-9-9-24 values at 1600MHz
• JEDEC standard 9-9-9-24 values at 1333MHz
• 4096 Megabytes of DDR3 memory
• Two matched CM3X2G1600C9DHXNV modules
• DHX technology provides maximum cooling
• Certified as SLI-Ready Memory
• 100% tested at 1600MHz in NVIDIA-based motherboards
• Lifetime warranty

Mushkin Ascent DDR3-1800 996626

Mushkin has the most original approach at packaging the memory kit. The modules come in a sturdy white wooden box that has the Mushkin logo on top and some basic information on the bottom. The box itself is sealed with the specification sticker of the kit. The box itself is, in my oppinion a nice touch...

After getting the box open, you find the modules firmly seated in foam. No instruction manuals this time.

The first thing you really notice when handling these modules is their weight. They really weight a ton! Its really not that hard to see what account for most of the weight. This time around the heatsinks are fairly low, but they are thick. Some of the thickness comes from the eVCI-system these modules use. eVCI stands for enhanced Vapor Chamber Interface. It really is a flat "heatpipe" that transfers the heat from the chips to the heatsinks. It has to be mentioned that the heatsinks are so thick this time that the modules won't fit in adjacent slots on every motherboard.

As far as looks go, I really like these. The design is nice and simple, nothing unnecessary. Both sides of the modules are covered by indentical heatsinks, but once again one side has the specification sticker.

• Frequency: 1800 MHz
• Latency: 8-8-7-20
• Voltage: 1.85 - 1.95 V
• Capacity: 2 x 1 GB
• Cooling: Ascent series heatsink with eVCI
• 100% Motherboard tested
• 10 Year Warranty
• Handselected chips

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