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Chill Factor
vs.
Liquid Pro

Author: Ville 'Willek' Kyrö
Published: 17.10.2007
Manufacturers: Thermalright
CoolLaboratory
Product Group: Cooling
In English In English
Suomeksi Suomeksi

Test setup

Our test system in this review is a mildly overclocked AMD opteron 170 processor, operating with default voltages. It is running at 2,4 Ghz, 400 Mhz over the stock speed. In this review we used the boxed heatsink, altough the boxed fan was replaced with a quiet 120 mm version.

The burn-in and stress tests were performed in open-air enviromment without the case. Since the point of this review is to measure the temperature difference between these two products, it is not necessary to enclose the components inside an eclosure.

 


 


 

Both the processor and the boxed heatsink are unlapped, and straight-from-the-box quality, to better bring out the difference between the products and simulate real life usage.

 


 

As mentioned earlier, the Chill Factor was easy to spread, and it formed a good contact.

 


 

The Liquid Pro in the other hand was a very different matter. It was difficult to estimate the required amount to use. In addition, it was quite hard to spread evenly with the needletip. I used the base of the cooler to help spread the product more evenly. One should be very careful not to get this stuff on the motherboard, since it conducts electricity.




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